schottky barrier diode z a pplic a t ion rectify i ng small pow er z f eatu r es 1) ultra small mold ty pe. 2) low v f 3) high reliability z cons tr uc tion silicon epit a xial planer z a b so lu te maximu m ratin g s (t a= 25 c) s y m bol u n i t v r v io m a i fs m ma tj tst g pa r a m e t e r r e ve r s e vol t age ( d c ) v e r a g e r e ct i f i e d f o r w ar d cur r e nt - 40 t o +125 li m i t s 30 100 w a r d cur r e nt sur g e pe ak 60hz ? 1cyc 500 i on t e m p e r at ur e t or ag e t e m p e r at ur e 125 a for junct s z electrical ch aracteristics (t a= 25 c) sym bol mi n. typ. m a x . u n i t v f - - 0. 35 v i f =1 0m a i r -- 1 0 a v r = 10v r e ve r s e cur r e nt pa r a m e t e r w a r d vol t age c ondi t i ons for sod - 723 2 lrb521g-30t1g 1 2 anode 1 cathode device marking shipping 4000/tape&reel lrb521g-30t1g f o rdering i nformation z leshan radio company, ltd. z we declare that the material of product compliance with rohs requirements. we declare that the material of product is halogen free (green epoxy compound). z rev.o 1/4 s-lrb521g-30t1g 4) s- prefix for automotive and o ther applications req uiring uniq ue site and control change req uirements; ae c-q 101 q ualified and ppap capable.
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sod?723 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min nom max millimeters a 0.49 0.52 0.55 b 0.25 0.28 0.32 c 0.08 0.12 0.15 d 0.95 1.00 1.05 e 0.55 0.60 0.65 1.35 1.40 1.45 l 0.15 0.20 0.25 h e 0.019 0.020 0.022 0.0098 0.011 0.013 0.0032 0.0047 0.0059 0.037 0.039 0.041 0.022 0.024 0.026 0.053 0.055 0.057 0.006 0.0079 0.010 min nom max inches d e b c a l 2x ?y? ?x? 0.08 (0.0032) xy h e 0.45 0.0177 0.50 0.0197 1.1 0.043 mm inches scale 10:1 soldering footprint* leshan radio company, ltd. rev.o 4/4 lrb521g-30t1g , s-lrb521g-30t1g
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